KAPA®
KAPA® FIVE-DOT-MISSION
KAPA®, a high-quality lightweight foamboard with a polyurethane foam core and individual paper cover layers, has been assessed in line with our MISSION: TOGETHER. RESPONSIBLE. KAPA®line, KAPA®bright, KAPA®plast, KAPA®tex, KAPA®graph, KAPA®mount and KAPA®fix currently achieve a FIVE-DOT classification with a total of 6 points.
Biobased Content
Not only polyurethane but also an assortment of paper cover layers is used in the production of our KAPA®, foamboard manufacture. The expanded polyurethane foam core comprises 15 % of organic content. These polyols are sourced from renewable raw materials. The paper used in our production process is almost exclusively FSC®-certified paper (FSC® C127595), and this makes up the main part of the board. The FSC® label stands for a continuous and credible tracking process. It is a clear indicator that the paper comes from responsible forestry and other controlled sources. We are constantly monitoring the availability of other FSC®-certified cover layers, as we are committed to manufacturing as many products as possible using paper from responsible sources.
CO2 Footprint
KAPA® is ultra-light due to the special manufacturing technology featuring an expanded foam core between the two outer paper cover layers. The foamed core reduces the use of resources. This, combined with the use of paper, a renewable raw material, as the main component of the board in terms of weight, means that KAPA® has one of the lowest carbon footprints in our portfolio.
Product life cycle
The average life span for KAPA® foamboards ranges from several weeks to several months. Depending on the application and location, e.g. in museums, the foamboards’ service life can be considerably longer. KAPA® is more durable than other lightweight foamboards especially when service temperatures are at a consistent -20° to +100°C. The KAPA® product family has been successful in the market for over 50 years and is simply indispensable for numerous short-term and medium-term interior applications.
